LMV3X series low voltage rail-to-rail output general purpose operational amplifiers

2023-12-07

The LMV3X series launched by XBLW brand is a general purpose operational amplifier with low rail-to-rail output, with 1MHZ general gain bandwidth, 1mV low offset voltage, and the static power consumption is greatly reduced to microamps, only 80uA, com…

XBLW super strength brand attracted a big crowd!! | ES SHOW ends beautifully!

2023-12-07

The three-day (October 11 - October 13) electronic components and materials procurement exhibition has come to a perfect end, the electronics exhibition was held in Shenzhen International Convention and Exhibition Center (Bao an New Hall), XBLW unique…

Xinbole participated in the 6th Council of Shenzhen Electronic Chamber of Commerce

2023-12-07

On July 28, the third meeting of the sixth Council of Shenzhen Electronic Chamber of Commerce was held in Shenzhen Guangming Victory. Li Shucheng, president of Shenzhen Electronic Chamber of Commerce and President of Shenzhen Huaqiang Group Co., Ltd. …

About the "silk screen" change announcement

2023-12-07

Molex introduces the first chip-to-chip 224G connector portfolio

2023-12-05

Instructions are streamlined, modular, scalable... Having reached the milestone of 10 billion shipments in seven years in 2022, RSIC-V is giving full play to its open source advantages and expanding its territory all the way. As the inventor and leade…

Focusing on chip research and development, SAIC-GM-Wuling signed an agreement with CETCA chip

2023-06-17

Recently, SAIC-GM-Wuling held the signing ceremony of the strategic cooperation agreement with CETCA chips. According to the official news of SAIC-GM-Wuling, the two sides will take this signing of the strategic cooperation agreement as an opportunity…

IPO and project signing, this semiconductor factory welcomes two major developments

2023-06-17

In the post Moore era, as the pace of pursuing high-precision process technology slowed down, advanced process research and development fell into a bottleneck period, and characteristic processes became another way to improve chip performance.The chip…

TI uses embedded FRAM as a new nonvolatile memory technology

2023-06-17

Texas Instruments (TI) has produced 64 megabit ferroelectric memory (FRAM) chips in the standard CMOS logic process, thus identifying this technology as a cost-effective alternative to embedded flash memory and embedded DRAM in various application fie…

Q1 The revenue of the world's top ten wafer foundries all fell

2023-06-17

According to the research of rendForce Jibang Consulting, the revenue of the worlds top ten wafer OEMs fell 18.6% in the first quarter, about US $27.3 billion, due to the continued weakness of terminal demand and the addition of off-season effects.The…

The 2023 Qingdao International Display Conference will be held in Qingdao on June 20th

2023-06-17

As an important port for intelligent interaction, the current new display has become an important support and foundation for carrying emerging industries such as ultra-high definition video, the Internet of Things, and virtual reality. It is a strateg…